“It is chemically, mechanically and thermally robust and can be patterned and seamlessly connected to semimetallic epigraphene using conventional semiconductor fabrication techniques.”
Sounds promising.
Can someone explain the implications of the bandgap and room temperature mobility values for future chip designs?
“It is chemically, mechanically and thermally robust and can be patterned and seamlessly connected to semimetallic epigraphene using conventional semiconductor fabrication techniques.”
Sounds promising.
Can someone explain the implications of the bandgap and room temperature mobility values for future chip designs?